Department of Electronics and Telecommunication Engineering
EventsNational Women's Entrepreneurship Enclave,Bangalore
15th Oct 2018DevFest 2018
Sohini Pandit, student of fourth year, Electronics and Telecommunication Engineering, attended the National Women Entrepreneurship Conclave as a representative of Padre Conceicao College of Engineering. The event was jointly organized by AICTE and International Institute of Waste Management(IIWM) , Bangalore on 3rd and 4th September 2018 and held at the Jain University Global Campus , Bangalore. The event was attended by 2000 aspiring women entrepreneurs in waste management and attempted to inspire the next generation of women entrepreneurs. Read more
15th Oct 2018Cadence- Design, Analysis and Simulation of Circuits
Dikshita Dessai, student of the Final year, Electronics and Telecommunication Engineering, was invited as a resource person to conduct a session on Machine Learning and its applications at Google Devfest 2018 on 10th September 2018 at CIBA, Assagao. She conducted sessions on Google’s ‘Machine Learning platform’ and ‘Action on Google ‘. The Action on Google campaign was to understand Google assistant and build actions for the same. Read more
15th Oct 2018
The Department of Electronics and Telecommunication Engineering, Padre Conceicao College of Engineering, Verna Goa organized a one week ISTE IETE approved STTP on "Cadence- Design, Analysis and Simulation of Circuits" from 01st to 05th January 2018. Read more
The Department of Electronics and Telecommunication of Padre Conceicao College of Engineering in association with the Robotics club of Padre Conceicao College of Engineering conducted a two week workshop cum internship programme on PCB Prototyping and AVR programming from 5th January 2015 to 16th January 2015 organised at Padre Conceicao College of Engineering, Verna, Goa. The aim of the programme was to provide the participants with a basic skillset that would be necessary in prototyping a PCB. The program was also intended for engineering students who wished to gain a deeper knowledge of the AVR microcontroller and its uses. About forty enthusiastic participants along with twelve volunteers participated in the programme.
Sharlaine Nicole Monteiro from ETC department organized a two week Internship : from 4th January 2016 to 15th January 2016 for the students of TE ETC and from 4th Juily to 15th July 2016 for SE ETC. Texas Instruments under its university program has donated “Analog Systems Lab Kit PRO” – 6 numbers. A set of design experiments is possible with the kits as per the laboratory manual provided with the kits. The kits can also be used for further designing and exploration in the Analog Domain. The experiments designed by experts from Texas Instruments are state of the art and involve entirely new approach towards covering the concepts of Analog Electronics from the system design perspective. A total of 9 TE ETC Students and 7 SE SETC students participated in the Internship program and worked on the kits and performed all the experiments which includes hardware implementation as well as software simulation using circuit simulators – TINA/ OrCAD-P-Spice. Internship certificates will be provided to the participating students. The deliverables for the internship were as follows: 1. Software simulation of the circuits using TINA/ OrCAD-P-Spice. 2. Experimental evaluation of the experiments. 3. A Report of the above activities
On 4th August 2016 an industrial visit was organized by the Training and Placement Office of Padre Conceicao College of Engineering to Bosch Packaging Technology Division, Verna Industrial Estate. The faculty who accompanied the students were Ms. Raksha Singhbal and Ms. Aditi Silveira.
The students and faculty departed for the field trip at 2pm. On arrival, they were escorted into the company premises where they were welcomed by Mr. Derek D’Souza, the HR Manager. He gave them a brief introduction about the work done in the industry. He also informed them about safety measures they were needed to practice and the rules of the company. He then handed them over to a senior engineer who educated them about various machines and the flow of processes in detail. He told them as to how in 2007, Bosch opened up a branch in Goa. Along with global expertise, Bosch industry offers tailor made packaging solutions for the Indian market. He made them aware of modern testing infrastructure, which boasts advanced test rooms and machines, which facilitate the testing of packaging products and product parts. The plant is also incorporated with an internal and external training facility. It allows buyers and customers to acquaint themselves with operating and maintaining new machines. He led us to the area where all the materials for packing were stored, called the stores, followed by the quality unit wherein quality testing and checking was done.
mentioned that there were 2 types of automated assembly line product packaging systems that are commonly used in their industry for packing food and a wide variety of products namely vertical form fill sealing machine (VFFS) and horizontal form fill sealing machine (HFFS). At the end of the visit they were shown into a room where all the products they had built packaging machinery were stored. This industrial visit was coordinated by Mr. Saeesh Verenkar, Training and Placement Office.
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